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Liquid Cooling Heat Dissipation Liquid Cold Plate Thermal Component Cooling System

Brand Name:	Uchi
Model Number:	Heat Sink
MOQ:	100pcs
Price:	1300-1500 dollars
Payment Terms:	T/T，paypal， Western Union,MoneyGram
Supply Ability:	50000000pcs per Month

Detail Information

Product Description

Detail Information

Place of Origin:

Dongguan，Guangdong,China

Certification:

SMC

Ambient Temperature:

-30~55°C

Humidity:

5%～90%

Number Of Waterways:

6 Waterways

Single Gross Weight:

3.710 Kg

Texture Of Material:

6061

Article No:

Liquid Cooling Plate 14

Feature:

High Cooling Power Capability

Fan Life:

100000 Hrs

Cone Pipe Thread:

ZG, G, NPT, Etc

Base Material:

Aluminum Or Copper

Noise Range:

9.5-25

Noise:

17dbA

Type:

Thermal Cooling Plate

Mountingtype:

Screw Mounting Holes

Maxoperatingtemperature:

120°C

Highlight:

Heat Dissipation Liquid Cold Plate

Liquid Cooling Thermal Component

Compact Cooling System Plate

Product Description

Liquid Cooling Heat Dissipation Liquid Cold Plate Thermal Component Cooling System

A high-performance liquid cooling heat dissipation component different from traditional milled/grooved water cooling plates, specially designed for high-power fiber lasers and optical communication modules.

Definition and Core Structure

Definition: Groove-free does not mean no flow channels. Instead of adopting the traditional process of mechanical milling/grooving plus cover plate welding, it is an optical fiber water cooling plate with integrated sealed flow channels realized through processes such as Friction Stir Welding (FSW), diffusion bonding, or embedded copper tubes. The flow channels are embedded inside the metal substrate with no groove marks on the surface, achieving extremely high overall flatness.

Core Components

Substrate: 6061/6063 aluminum alloy (cost-effective), oxygen-free copper (excellent thermal conductivity, high cost)
Internal flow channels: serpentine / parallel microchannels, embedded copper tubes, with no exposed notches
Inlet and outlet water connectors: G1/4, NPT, etc., sealing structure (FSW solder-free sealing to prevent leakage)
Surface treatment: anodizing (corrosion protection), conductive oxidation, nickel / tin plating (to meet different installation requirements)

Working Principle

The flat bottom surface of the cooling plate is closely attached to heat sources such as pump sources, beam combiners, and laser cavities of fiber lasers via thermal grease or phase change materials.

Heat is rapidly conducted through the high-thermal-conductivity substrate to the internal flow channel walls.

Deionized water or ethylene glycol aqueous solution (commonly used) circulates inside the flow channels and removes heat through forced convection.

The hot fluid returns to the Cooling Distribution Unit (CDU) or chiller for heat exchange and cooling, forming a closed-loop cooling system.

The groove-free structure reduces thermal resistance interfaces, improves heat transfer efficiency, and avoids stress concentration and corrosion risks at groove edges.

Mainstream Manufacturing Processes

Friction Stir Welding (FSW, most widely used): Pre-set flow channel space between two plates; solid-state welding achieved through thermo-mechanical effects generated by a high-speed rotating stirring tool. It features no porosity or cracks, no solder required, minimal deformation, and is suitable for large-size, high-load fiber optic water cooling plates.
Embedded copper tube + vacuum brazing: Pre-fabricated copper tubes embedded into blind holes of the substrate, with gaps filled via vacuum brazing to form seamless flow channels.
Diffusion bonding: Metallic atomic bonding achieved under high temperature and pressure, suitable for ultra-thin and ultra-precision flow channels but at relatively high cost.

Performance Advantages and Comparison

Comparison Item	Groove-Free Fiber Optic Water Cooling Plate	Traditional Milled Groove Water Cooling Plate
Surface Flatness	Extremely high (≤0.05 mm/100 mm), gap-free attachment	Poor, prone to burrs/deformation at groove edges
Thermal Resistance	Lower (reduced groove interface thermal resistance)	Higher, greatly affected by milling depth and cover fitting
Leakage Resistance	Excellent (FSW solid-state welding, solder-free, high pressure resistance)	Average (welds prone to corrosion, low pressure limit)
Structural Strength	High, good overall rigidity, resistant to vibration & impact	Low, grooves weaken substrate strength
Applicable Power Density	High (≥500 W/cm², suitable for kW-class fiber lasers)	Low to medium (≤300 W/cm²)
Cost	High initial cost, low long-term maintenance cost	Low initial cost, high failure risk and maintenance cost later

Key Technical Parameters

Dimensions: Customized according to fiber laser modules (common sizes: 300×200 mm, 400×300 mm, etc.)
Flow channel parameters: inner diameter 2-6 mm, flow velocity 1-3 m/s, pressure drop ≤0.3 MPa
Heat dissipation capacity: single cooling plate supports 500 W-10 kW heat sources
Operating pressure / temperature: 0.5-1.0 MPa, -20℃-80℃
Materials: aluminum alloy (thermal conductivity 200-220 W/(m*K)), copper (380-400 W/(m*K))
Sealing test: helium leak detection (leak rate ≤1×10⁻⁹ mbar*L/s) to ensure no leakage during long-term operation

Typical Application Scenarios

High-power fiber lasers: heat dissipation for pump modules, beam combiners, Q-drives in 1 kW-10 kW industrial cutting/welding lasers
Optical communication equipment: high-speed optical modules in data centers, coherent communication equipment, EDFA amplifiers
Medical laser equipment: fiber laser beauty devices, dental laser equipment
Semiconductor manufacturing: fiber transmission systems in laser annealing and laser dicing equipment

Selection and Design Guidelines

Heat source distribution: serpentine flow channels for uniform distribution, parallel flow channels for multiple heat source points
Flow rate and pressure: ensure flow velocity ≥1 m/s to avoid local overheating
Material selection: aluminum alloy for general scenarios, copper for ultra-high heat flux density
Interface and compatibility: confirm specifications and positions of water inlet/outlet connectors to match existing chillers / CDUs
Environmental requirements: enhanced surface corrosion protection (e.g., hard anodizing) for outdoor / humid environments
Compliance: meet CE and RoHS; pressure testing required for high-pressure applications

Maintenance Recommendations

Replace coolant regularly (every 6-12 months) to prevent scaling
Conduct pressure testing and helium leak detection annually to check for leaks
Keep the cooling plate surface clean to avoid oil contamination impairing thermal conductivity
Avoid severe impact and vibration to prevent flow channel deformation

Tags:

Liquid Cooling Plate

Liquid Cold Plate

Cold Plate

Chill Plates

Cooling Plate

Water Cooling Plate

Skived Fin Heat Sink

Optical Fiber Cold Plate

Extruded Heat Sink

Heat Sink Plates

Microchannel Heat Exchanger

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