Custom Pure Copper Skived Fin Heatsink | Cooler for Electronic Chip LED RAM Cooling
Product Overview
We are a professional thermal factory providing OEM/ODM custom pure copper skived fin heatsinks, specially designed for compact cooling of small high-heat electronic components including electronic chips, LED diodes and RAM modules. The entire heatsink (base and fins) is integrally skived from a single solid copper block, with no welding or bonding interface, eliminating extra thermal resistance. The precision skiving process enables ultra-thin dense fins, maximizing heat exchange area in tiny PCB space, efficiently removing concentrated heat from small components to prevent overheating.
Key Advantages
✅ One-piece skived pure copper structure
Integrally formed from C1100 oxygen-free copper, no welding joints. Ultra-high thermal conductivity, rapidly transfers concentrated heat from small chips/LED/RAM to fins, delivers much better performance than aluminum heatsinks for small high-power components.
✅ Ultra-compact high-density fins
Skiving process allows ultra-thin fins (down to 0.2mm) and narrow fin pitch, creating large heat exchange area in extremely small size. Perfect for limited PCB space, no interference with surrounding components on motherboard.
✅ Full flexible customization
Fully customizable overall dimension, fin height, fin pitch, mounting hole position, notches and base flatness. Can be tailored to fit specific RAM module, LED chip, power chip or other small electronic components. Surface options: bare copper, nickel plating for long-term anti-oxidation.
Own skiving, CNC machining and surface treatment workshop. Provide free thermal simulation, rapid prototyping (5-8 days) and mass production support, flexible for small-batch custom projects.
✅ Reliable & compliant
Strict dimension inspection and thermal performance testing. RoHS compliant, stable for long-time continuous operation in consumer and industrial electronic devices.
Specifications
Material: C1100 Oxygen-free Pure Copper
Process: One-piece skived fin forming
Fin thickness: 0.2mm–0.8mm (customizable)
Fin pitch: 1.2mm–3.0mm (customizable)
Dimension: Fully custom, available from tiny 20×20mm to larger sizes
Surface: Bare copper, nickel plating optional
Base flatness: ≤0.03mm
Tolerance: ±0.02mm
Sample lead time: 5–8 working days
Application Scenarios
RAM memory module cooling, LED diode cooling, small electronic chip cooling, MOSFET, power management chip, embedded system components, motherboard peripheral chips, mini LED module, high-power small electronic devices.
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