Gold Plated Miniature Liquid Cold Plate Low Thermal Resistance Applications

Gold-plated miniature liquid cooling plates are micro liquid cooling heat dissipation components designed for high-precision, high-reliability, and low-thermal-resistance applications. They feature centimeter-scale dimensions and millimeter-level thickness with a core structure consisting of copper, aluminum, or molybdenum-copper base with gold-plated surface, achieving ultra-low interface thermal resistance, corrosion resistance, oxidation resistance, solderability, and bondability.

• Base material: oxygen-free high-conductivity copper (OFHC Cu) or molybdenum-copper (MoCu) with thermal conductivity of 380~401 W/m*K
• Flow channels: micro-channels, pin fins, or etched channels (50~200μm width) with thermal resistance as low as 0.01~0.05℃*cm²/W
• Gold-plated interface: non-oxidizing gold (~317 W/m*K) with extremely low contact thermal resistance
• Ultra-thin profile: 1~5mm thickness providing extremely short heat transfer path

• Processes: vacuum brazing, diffusion bonding, laser welding (adhesives and sealing rings free)
• Pressure resistance: 3~10 bar, helium leak rate ≤1×10⁻⁸ Pa*m³/s
• Small size: 20×20mm ~ 80×80mm, suitable for chips, lasers, and RF devices

• Gold plating thickness: 0.1~2μm (commonly 0.5~1μm)
• Chemical inertness: water resistant, salt spray resistant, non-oxidizing, free from galvanic corrosion
• Diffusion barrier: 3~5μm nickel underlayer to prevent copper migration
• Temperature range: -55℃~150℃, stable under thermal cycling
• Service life: meets aerospace/optical module standards (10~20 years)

• Reduce interface thermal resistance: direct contact with chips/heat sinks, no oxide layer, stable thermal resistance
• Anti-corrosion: no rust, scaling, or electrical leakage in coolant or air environments
• Solderable & bondable: compatible with soldering, AuSn soldering, and ultrasonic bonding
• Anti-galvanic corrosion: stable potential between copper and gold in liquid cooling systems
• High reliability: zero-failure requirements for aerospace, and medical applications

Copper etching → cover plate brazing → overall gold plating. Applications: lasers, optical modules, AI chips, FPGAs, high-power ICs.

Thin copper tubes (φ1~3mm) press-fitted/brazed → surface gold plating. Applications: medical instruments, high-precision sensors, small lasers.

Low thermal expansion, high thermal conductivity, with nickel + gold plating barrier layer. Applications: aerospace, high-power microwaves, VCSEL/pump sources.

• Optical communications: TOSA/ROSA, EDFA, high-speed optical modules, laser diodes
• Semiconductors: high-end CPU/GPU/ASIC, SiC/GaN power chips, probe stations
• Aerospace: missile-borne computers, radar T/R components, satellite electronics
• Medical treatment: precision instruments, laser therapy, superconducting/cryogenic probes
• High-end industrial control: high-precision servos, LiDAR, quantum computing chips