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Liquid Cooled Cold Plate Heat Exchanger for Custom Cold Plates Cooling

Name: Liquid Cooled Cold Plate Heat Exchanger for Custom Cold Plates Cooling
Brand: Dongguan Uchi Electronics Co.,Ltd
SKU: Heat Sink
Price: 1,400.00 USD
Availability: InStock

Brand Name:	Uchi
Model Number:	Heat Sink
MOQ:	100pcs
Price:	1300-1500 dollars
Payment Terms:	T/T，paypal， Western Union,MoneyGram
Supply Ability:	50000000pcs per Month

Detail Information

Product Description

Detail Information

Place of Origin:

Dongguan，Guangdong,China

Certification:

SMC

Material:

Copper / Aluminum

Noise:

17dbA

Bearing:

Alloy Bearing

Materials:

Copper + Aluminum Alloy

Maxoperatingpressure:

5 Bar

Nominal Pressure:

25MPa --40MPa

Power:

320 W

Technology:

Zipper Fin

Protection Class:

IP54

Thermal Dissipation Power:

2000W

Highlight:

Liquid Cooled Cold Plate Exchanger

Custom Cold Plates Heat Sink Cooling

2000W Power Custom Cold Plates

Product Description

Liquid Cooled Cold Plate Heat Exchanger for Custom Cold Plates Cooling

Heat Exchanger Liquid Cooled Cold Plate

Product Specifications

Material: AL 1100

Size: 5x7x3cm

Weight: 0.15kg

Technology: FSW Cooling

Feature: High cooling capability and Fast cooling

Surface Treatment: Oil cleared, cleaned and passivation

Heat Conducting Power: 260W

Liquid Cooled Cold Plate Heat Exchanger (Cold Plate Heat Exchanger), commonly referred to as liquid cooling plate, is a high-efficiency liquid cooling heat dissipation component specially designed for high-power-density applications. By making direct contact with heat sources, it rapidly removes heat via internally flowing fluid, with heat dissipation performance far exceeding traditional air cooling.

Core Working Principle

Based on the thermodynamic principles of thermal conduction and forced convection:

Thermal Conduction & Heat Absorption

The metallic baseplate of the cold plate is tightly attached to heat-generating devices such as CPUs, GPUs, and IGBTs. Thermal Interface Material (TIM) is used to eliminate air gaps, enabling efficient heat transfer into the cold plate.

Convective Heat Transfer

Coolant (water, glycol solution, dielectric fluid, etc.) flows through precision-designed internal channels, absorbing heat from the baseplate via forced convection.

Heat Transportation

The heated coolant exits the cold plate, releases heat in an external CDU (Cooling Distribution Unit) or radiator, and is recirculated after cooling.

Main Structure & Types

Core Materials

Copper (Cu): Extremely high thermal conductivity (~400 W/m*K), optimal heat dissipation performance, widely used for high-performance chips.
Aluminum (Al): Low cost, lightweight, commonly applied in power batteries and industrial equipment.

Internal Channel Structures

Tube-in-Plate Liquid Cooling Plate

Structure: Grooves machined in the metal baseplate, with copper tubes embedded and hermetically welded.
Features: Mature manufacturing process, high pressure resistance, moderate cost.

Folded / Stacked Type (Milled & Welded)

Structure: Complex flow channels milled into the baseplate, then sealed and welded with a cover plate.
Features: Flexible channel design, large heat exchange area, low thermal resistance.

Micro-channel Type

Structure: Ultra-fine flow channels (width ≤ 1 mm), providing extremely high specific surface area.
Features: Ultra-high heat dissipation (heat flux exceeding 500 W/cm²), high pressure drop, strict requirements for coolant cleanliness.

Pin-fin / Skived Fin Type

Structure: Integrated pin-shaped or thin fin structures formed directly from the baseplate.
Features: No welding-induced thermal resistance, strong turbulence, high heat dissipation efficiency.

Key Performance Parameters

Thermal Resistance (Rth): Core performance indicator, typically 0.02 ~ 0.1 ℃/W; lower value means better heat dissipation.
Heat Dissipation Capacity: Single cold plate can handle 500W ~ 2000W+ of power.
Pressure Drop (ΔP): Flow resistance of the coolant, affecting pump power consumption.
Operating Pressure: Standard rated pressure 2~5 bar, burst pressure generally ≥ 8 bar.

Main Application Fields

Data Centers / High-Performance Computing (HPC): Cooling for AI server GPUs and CPUs, supporting high-density computing power.
New Energy Vehicles: Thermal management of power battery packs, heat dissipation for motor controller IGBTs.
Industrial & Medical Equipment: Lasers, power inverters, medical imaging devices.
Aerospace: High-reliability heat dissipation for radar systems, satellite payloads, etc.

Core Advantages

High Heat Dissipation Efficiency: 10~25 times the capacity of air cooling.
Low Noise & Energy Saving: No high-speed fan noise; system PUE can be reduced to below 1.1.
Precise Temperature Control: Small temperature fluctuations, extending service life of electronic components.
Compact Size: Smaller volume than air-cooled heat sinks, suitable for highly integrated equipment.

Difference from Traditional Plate Heat Exchangers

Liquid Cooling Cold Plate: Absorbs heat from one side, mainly used for device-level / chip-level cooling with direct contact to heat sources.
Plate Heat Exchanger (PHE): Performs heat exchange on both sides, used for system-level liquid-to-liquid / liquid-to-gas heat transfer (e.g., inside a CDU).

Core Selling Points

Performance Advantages

Ultra-High Heat Dissipation Efficiency: With strong heat flux carrying capacity, its heat dissipation efficiency far exceeds that of air cooling in the same volume.
Ultra-Low Thermal Resistance Design: Adopting integrated flow channel / microchannel structure to reduce welding thermal resistance.
Precise Temperature Control & Small Temperature Difference: Uniform liquid cooling heat transfer with small temperature fluctuations.
Adaptable to High Power Density: A single cold plate can support kilowatt-level heat dissipation.

Structural & Reliability Advantages

Compact Structure & Space-Saving: Slim design with small footprint, facilitating equipment miniaturization.
Pressure-Resistant Sealing & Low Leakage Risk: Mature welding / diffusion bonding technology ensures strong pressure resistance.
Selectable Materials & Wide Scenario Adaptability: Lightweight aluminum or high-thermal-conductivity copper.
Highly Customizable Flow Channels: Flow channels can be designed according to heat source layout.

Application & System Advantages

Silent & Noise-Free: No noise from high-speed fans, ideal for environments with high silence requirements.
Energy Saving & Consumption Reduction: High heat exchange efficiency lowers overall energy consumption.
Dust & Contamination Resistance & Easy Maintenance: Closed liquid cooling loop is immune to dust and oil.

Application Scenario Advantages

Universal for Multiple Fields: Suitable for new energy vehicles, AI servers, laser equipment, and medical instruments.
Strong Adaptability to High-Temperature Environments: Less affected by ambient temperature compared with air cooling.