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Folded Fin Heat Sink Copper Cold Plate Superior Thermal Conductivity Solution

Name: Folded Fin Heat Sink Copper Cold Plate Superior Thermal Conductivity Solution
Brand: Dongguan Uchi Electronics Co.,Ltd
SKU: Heat Sink
Price: 1,400.00 USD
Availability: InStock

Brand Name:	Uchi
Model Number:	Heat Sink
MOQ:	100pcs
Price:	1300-1500 dollars
Payment Terms:	T/T，paypal， Western Union,MoneyGram
Supply Ability:	50000000pcs per Month

Detail Information

Product Description

Detail Information

Place of Origin:

Dongguan，Guangdong,China

Certification:

SMC

Material:

Copper

Size:

15*2.8*0.3CM

Weight:

0.09 Kg

Technology:

Stamping Fin

Feature:

Flexiable And Ajustable

Surface Treatment:

Passivation

Heat Cooling Power:

45W

Highlight:

Folded Fin Copper Cold Plate

Superior Thermal Conductivity Plate

High Efficiency Heat Sink

Product Description

Folded Fin Heat Sink Copper Cold Plate Superior Thermal Conductivity Solution

Copper Folded Fin Heat Sink for Various Shapes

You can rest assured to buy Copper Folded Fin Heat Sink for Various Shapes from our factory and we will offer you the best after-sale service and timely delivery.

Product Parameters

Material: Copper
Size: 15 × 2.8 × 0.3 CM
Weight: 0.09 kg
Technology: Stamping fin
Feature: Flexible and adjustable
Surface treatment: Passivation
Heat cooling power: 45W

Product Advantages

High density fins heat sink stacked fin heat sink combination heatsink design makes it possible to fabricate large sized densely packed fabfin structures for high power heat sink requirements. Unlimited possibilities as to length, width, height, fin thickness and fin spacing. Swaged process allows a multitude of aluminum fins to be mechanically attached to dual aluminum baseplates at the same time without using any adhesive.

The concept of increasing fin efficiency by sharing fins between two baseplates originated in the one piece hollow extrusion. The standard available line of shapes extends almost every 0.25" in height from 1.00" to 8.00" high at fin spacing of about 0.10", and high aspect ratios could reach 50:1.

Therefore, high density stacked bonded extrusion heatsink will be a smart choice.

Technical Overview

A Copper Folded Fin Heat Sink leverages copper's superior thermal conductivity (≈401 W/m*K vs aluminum's 205 W/m*K) and the folded-fin process's high surface-area density, while being fully customizable into diverse shapes for constrained high-heat applications.

Manufacturing Process & Materials

Material Specifications: Typically pure copper (C11000/C10200, oxygen-free copper for ultra-high conductivity); fin thickness 0.1-0.4 mm, folded into corrugated/zig-zag arrays, then bonded to a copper base via brazing (vacuum/atmospheric), solder reflow, or high-performance thermal epoxy. Base thickness can be independently optimized (3-20 mm common).
Fin & Shape Customization: Fins can be flat-crest, rounded-crest, wavy, lanced-offset, or herringbone; bases can be CNC-machined into complex geometries (holes, cutouts, curves, steps) post-bonding.
Surface Treatments: Nickel plating (corrosion resistance, solderability), black oxide, passivation; avoid anodizing (copper anodization is unstable vs aluminum).

Core Advantages vs Aluminum Folded Fin

Higher Thermal Conductivity & Heat Spreading: Faster heat transfer from source to fin tips, critical for high-heat-flux (≥100 W/cm²) scenarios.
Better Performance at Low Airflow: More effective passive cooling, though forced air still drastically improves efficiency.
Durability & Corrosion Resistance (with plating): Suitable for harsh environments (automotive underhood, industrial controls).
Drawback: ~3x heavier than aluminum, higher material and processing costs.

Design & Optimization Tips

Thermal Load & Airflow: Calculate required thermal resistance (Rθja, Rθjc) and match to CFM/LFM; dense folded fins need ≥100 CFM forced air to avoid airflow stagnation.
Fin Pitch & Height: For forced air, 1.0-2.0 mm pitch balances surface area and pressure drop; taller fins (up to 60 mm) improve convection but add weight.
Bonding Quality: Vacuum brazing > solder > epoxy for thermal contact; poor bonds create hotspots—verify with thermal imaging or Rθ measurement.
Weight Budget: Copper's density (8.96 g/cm³) requires careful mass control in aerospace/portable devices; consider copper-fin+aluminum-base hybrid designs.

Applications

Predominantly in high-power electronics: automotive EV inverters, server CPUs/GPUs, 5G base station power amplifiers, industrial IGBT modules, laser diodes, and medical equipment where reliability and thermal performance take priority over cost/weight.

Sourcing & Cost Considerations

MOQ is often 100-500 units for custom shapes; tooling costs rise with complexity (curved/annular > rectangular).
Lead time: 4-8 weeks for design, prototyping, and production runs.
Cost drivers: material price, fin density, bonding method, plating, and custom machining steps.

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