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High Density Cooling System Aluminum Zipper Fin Heatsink | OEM Server Laptop CPU Cooler

High Density Cooling System Aluminum Zipper Fin Heatsink | OEM Server Laptop CPU Cooler

Brand Name: Uchi
Model Number: Computer radiator
MOQ: 100pcs
Price: Negotiable
Payment Terms: T/T,paypal, Western Union,
Supply Ability: 50000000pcs per Month
Detail Information
Place of Origin:
Dongguan,Guangdong,China
Certification:
SMC
Technology:
Friction Welding Stir+CNC Machined
Highlight:

Aluminum Zipper Fin Heatsink

,

OEM Server CPU Cooler

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Laptop CPU Cooling System

Product Description

High Density Cooling System Aluminum Zipper Fin Heatsink | OEM Server Laptop CPU Cooler


Product Overview


We are a professional thermal solution factory offering OEM/ODM custom high-density aluminum zipper fin heatsinks, specially designed for compact cooling demands of server and laptop CPUs. This zipper fin cooling system adopts precision staked zipper fin technology, which enables ultra-high fin density with ultra-thin fins and narrow fin pitch, maximizing heat exchange area within limited space. Paired with heat pipes for efficient heat spreading, it delivers excellent cooling performance for high-power processors in slim chassis. Both active (with fan) and passive cooling configurations are available, fully customizable to your project requirements.

Key Advantages


✅ Ultra-high density zipper fin structure

Zipper fin technology achieves much higher fin density than conventional extruded, stamped or skived fins. Ultra-thin fins (down to 0.15mm) and narrow pitch maximize heat exchange area in compact space, ideal for high heat flux CPU in slim laptop and 1U/2U servers.

✅ Lightweight aluminum material

High thermal conductivity aluminum alloy, much lighter than copper, perfectly meets the weight-sensitive demand of laptop and rackmount server devices, without compromising cooling performance.

✅ Full flexible customization

Fully customizable fin thickness, fin pitch, fin height, overall dimension, heat pipe layout, fan configuration and mounting brackets. Compatible with various Intel/AMD CPU sockets and specific chassis space constraints. Surface treatment options include black anodizing, clear anodizing to enhance anti-oxidation and radiation cooling.

✅ Minimal interface thermal resistance

Precision interference fit and brazing bonding process between fins, heat pipes and base plate ensures tight contact and low thermal resistance, enabling rapid heat transfer from CPU to the entire fin stack.

✅ In-house one-stop manufacturing service

Own full production line covering fin stamping, zipper fin stacking, heat pipe processing, bonding and surface treatment. Our engineering team provides free CFD thermal simulation, DFM review, rapid prototyping (7-10 days) and mass production support for your OEM projects.

✅ Industrial-grade reliability

Strict dimension inspection, thermal performance testing and aging test. RoHS compliant, stable for 7×24 hours continuous operation in harsh environment.

Specifications


  • Material: Aluminum 6061/6063 alloy, optional copper heat pipes
  • Process: Zipper fin stacking, heat pipe expansion bonding, vacuum brazing
  • Fin thickness: 0.15mm–0.5mm (customizable)
  • Fin pitch: 1.0mm–3.0mm (ultra-high density optional)
  • Dimension: Fully custom, fit for slim laptop and 1U/2U server space
  • Cooling type: Active (with PWM fan) / Passive optional
  • Surface: Black anodizing, clear anodizing, passivation optional
  • Tolerance: ±0.03mm
  • Sample lead time: 7–10 working days

Application Scenarios


High-density server CPU cooling, slim laptop processor cooling, mini PC, edge computing devices, industrial embedded systems, 1U/2U rackmount equipment, all-in-one PCs.