Liquid Cooling Plate for high-performance computing
,
Scalable Liquid Cooling Plate solution
Product Description
1U Server CPU Copper Heatsink Product Description
Product Overview
This 1U low-profile all-copper CPU heatsink is specially designed for space-limited 1U rackmount servers and industrial control, short-depth storage servers. Two versions available: active blower version (with 7515 centrifugal fan) and passive fanless version. The base and fins are made of high-conductivity oxygen-free copper, manufactured by skived fin one-piece forming process with no thermal resistance from welding joints. Dense thin fins maximize heat exchange area within limited height. It reliably dissipates continuous high heat of server CPUs and supports 7×24h non-stop operation in data centers.
Key Advantages
✅ One-piece skived copper structure for superior heat transfer
Oxygen-free copper has much higher thermal conductivity than aluminum. Base and fins are integrally skived without welding interface. Heat transfers rapidly from CPU contact surface to fins. Better heat dissipation capacity at the same dimension, ideal for high TDP Xeon, Intel Core and AMD server CPUs.
✅ 1U ultra-low profile design
Total height ≤29mm, perfectly fits 1U chassis internal space, no interference with memory, power supply and expansion cards. Spring-loaded screws provide even mounting pressure to prevent CPU damage and ensure good contact.
✅ Dual ball bearing PWM blower fan (active model)
7515 centrifugal blower, DC12V, 4Pin PWM speed control. Dual ball bearing for long service life and high static pressure. Directed airflow blows through fin stack. Fan speed adjusts dynamically according to CPU temperature to balance cooling performance and noise.
✅ Optional fanless passive cooling solution
Pure copper fin stack without fan, zero noise, zero vibration and zero moving parts. Maintenance-free, perfect for silent industrial control and low-power embedded servers.
✅ Multi-socket compatibility & custom service
Compatible with mainstream Intel LGA115X / LGA1700 / LGA2011 / LGA3647, AMD AM4 / AM5 mounting holes. Customizable fin density, base size, mounting brackets and nickel-plated anti-oxidation surface. Small batch sampling supported.
✅ Industrial-grade reliability
Anti-oxidation surface treatment, resistant to moisture and dust in IDC environment. RoHS compliant for mass deployment in data centers and industrial automation equipment.
Structure & Basic Specifications
Active Version (with centrifugal blower)
Material: Oxygen-free copper base + skived copper fins
Dimension: Approx. 88×88×28mm (standard)
Fan: 7515 centrifugal blower, DC12V, 4Pin PWM
Bearing: Dual ball bearing
Speed: 1500–6800 RPM
Supported TDP: 120–130W
Mounting: Diagonal spring screws with backplate
Surface: Bare copper / Nickel plating optional
Passive Version (fanless copper heatsink)
Material: Full skived oxygen-free copper
Height: 24–27mm
Supported TDP: 65–145W (depends on chassis airflow)
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