| Brand Name: | Uchi |
| Model Number: | Heat Pipe Heat Sink |
| MOQ: | 100pcs |
| Price: | Negotiable |
| Payment Terms: | T/T,paypal, Western Union,MoneyGram |
| Supply Ability: | 50000000pcs per Month |
This curved round structure heat pipe heat sink is specifically designed for air conditioning applications, manufactured from high-quality CU 1100 material with a 12mm diameter. The heat sink features excellent high-pressure water transmission capabilities and passivation surface treatment, delivering reliable heat conducting power of 90W.
| Material | CU 1100 |
|---|---|
| Diameter | 12 mm |
| Feature | High pressure water transmission |
| Surface Treatment | Passivation |
| Heat Conducting Power | 90W |
High-integration chips serving as core business processing units require efficient thermal management due to their simultaneous multi-tasking capabilities and rapid data processing speeds. These operations generate significant power consumption and heat that must be effectively transferred to prevent thermal accumulation.
Without proper heat dissipation, internal device temperatures rise sharply, leading to excessive junction temperatures within the chip. This can cause device failure, restart cycles, system crashes, or complete chip burnout, resulting in equipment damage and user losses.
Industry standard practice involves installing chip heat sinks on high-heat generating chips, integrated with thermal design processing systems for effective heat discharge. For lightweight applications, thermal conductive silica gel or pads are directly adhered to chips, while larger heat sinks require more secure mounting methods to ensure stability and reliability during transport and operation.
Heat sinks with welded feet provide secure circuit board attachment through diagonal platform processing. Each platform embeds a metal welding foot with pre-applied tin coating or tin-coated wire, while thermal conductive silicon grease or silica gel ensures optimal thermal interface between the chip and heat sink.
Our manufacturing facility features comprehensive air-cooled equipment including 10 low-temperature solder reflow ovens, 5 baking ovens, 20 automatic solder dispensing units, 3 automatic solder brushing machines, 50 torque-controlled electric screwdrivers, CCD inspection equipment, fully automatic optical module testing systems, multi-station thermal performance testing equipment, and flatness optical testing instruments.
We maintain rigorous quality standards with advanced testing equipment including Coordinate Measuring Machines, projector instruments, water high pressure testing machines, thermal resistance testing systems, and liquid leakage testing equipment.
We are a professional manufacturer of heat sinks and water cooling plates with extensive experience and a strong technical team, featuring automated and mechanized production.
60% of our total production is exported to Japan, India, UK, Canada, USA, and Brazil.
Approximately 100 employees across sales, purchasing, engineering, QA, warehouse, and production departments.
Yes, we provide samples for confirmation before mass production, along with technical drawings if required.
Customized packing with normal cartons and tight-proof fabric or wooden cartons for optimal protection during transportation.
All products are fully inspected before shipping. For any issues, we provide immediate technical solutions.