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CPU Microprocessor Cold Plate Cooling Heat Sink Electronic Devices Solution

Brand Name:	Uchi
Model Number:	skived fin heat sink 02
MOQ:	100pcs
Price:	Negotiable
Payment Terms:	T/T，paypal， Western Union,MoneyGram
Supply Ability:	50000000pcs per Month

Detail Information

Product Description

Detail Information

Place of Origin:

Dongguan，Guangdong,China

Certification:

SMC

Processing Service:

Cutting, Punching, Decoiling, Bending, Drilling

Temper:

T3~T8

Packing:

PE Bag Carton

Tolerance:

±1%

Standard:

Middle And High Quality Aluminium Heatsink

Deep Process:

CNC Machining

Material:

Copper, Aluminum

Technology:

CNC & Skiving

Highlight:

CPU Microprocessor Cold Plate

Heat Sink Electronic Cooler

Cold Plate Cooling Heatsink

Product Description

CPU Microprocessor Cold Plate Cooling Heat Sink Electronic Devices Solution

Cold Plate Heat Sink for CPU Microprocessor Electronic Devices

Advanced liquid cooling solutions for high-performance computing applications including AI, data centers, and electronic devices requiring superior thermal management.

Manufacturing Specifications

Business Type	Factory / Manufacturer
Products	Skiving Fin Heatsinks, Liquid Cold Plates, Extruded Heatsinks, Stamping Heatsinks, Heat Pipe Heatsinks, Vapor Chamber, CNC Machined Parts
Type	Heatsinks
Service	OEM service, professional R&D support
Material	Aluminum/copper
Tool Cost	No Needed
Process	Cutting, Skiving, Extruded, Stamping, Rolling, Broaching, Punching, Drilling, Bending, Welding, Milling, Turning, CNC Machining, Grinding, Deburring, Cleaning, 100% Inspection, Packing, Delivery
Surface Treatment	Polishing, anodizing, powder coating, passivating, painting, plating, sand blasting, e-coating and others as requested
Dimension	Customized (Maximum skived heat sink size: W 1200 × L 3500mm)
Inspection	CMM, Two dimensional measuring instrument, Projector, Flatness measurer, Roughness measurer, Helium leaking testing equipment
Delivery Time	Sample lead time: 15-21 days. Production lead time: 25 days.

Industry Applications

Photovoltaics, Wind Power, Communications, LED, Electric Vehicles, Medical, Rail Transit, Microwaves, Automobile, Lasers, High Power Solar Inverter, High Power LED light, Data Center, IGBT cooling, Welding Machine, Artificial Intelligence

Advanced Cooling Solutions for Next-Generation Processors

With the rise of AI and HPC processing massive data volumes, next-generation processors will generate significantly more heat than current high-end models. Our liquid cooling solutions maximize heat dissipation efficiency, improve PUE values, and increase computing density per rack, positioning liquid cooling as essential for future data center infrastructure.

High-End Manufacturing Applications

Semiconductor and Chip Manufacturing

Advanced packaging technologies like 3D stacking create internal heat accumulation where traditional material thermal conductivity becomes a bottleneck.

AI Computing/Data Centers

Surging chip heat flux density challenges traditional cooling methods, making thermal management a critical factor in computing power improvement.

Aerospace

Extreme temperature environments and vacuum conditions eliminate convective heat dissipation options, requiring specialized thermal management solutions.

Everyday Applications

Digital Devices

Metal cooling fins in computers, mobile phones, and game consoles ensure sustained performance.

Communication Devices

Large heat sinks maintain stability for high-speed data transmission and processing.

Household Appliances

Compressors and condensers require efficient heat transfer from indoor to outdoor environments.

Lighting Devices

Efficient heat dissipation ensures LED luminous efficacy and extended service life.

New Energy Vehicles

Sophisticated liquid cooling systems maintain optimal operating temperatures.

Manufacturing Capabilities

Our mold workshop features 22 electric discharge machines including 2 MAKINO mirror EDM machines, 9 wire-cut EDM machines (3 Seibu and 1 Sodick from Japan), 7 spark erosion machines, 10 grinding machines, 2 milling machines, and 1 lathe.

Technical Specifications

Table size: 500×350 mm
Rapid traverse speed: 5000 mm/min
Maximum workpiece weight: 500 kg
Maximum electrode weight: 50 kg

Precision Engineering

Utilizing SuperSpark4 and IES (Intelligent Expert System) technologies for adaptive power supply and jump control to stabilize EDM processes and enhance machining precision. Advanced ultra-surface and ultra-edge generator technologies deliver exceptional surface finish and metallurgical quality.

Product Applications

Quality Assurance

Rigorous quality standards maintained with comprehensive testing equipment:

1 Coordinate Measuring Machine
1 projector instrument
2 water high pressure testing machines
4 thermal resistance testing machines
2 liquid leakage testing machines

Customer Service Commitment

Prompt response to all inquiries
Competitive pricing with guaranteed quality
Efficient production scheduling
Optimal transportation solutions
Comprehensive technical support

Frequently Asked Questions

Are you a trading company or manufacturer?

We are a professional manufacturer of heat sinks and water cooling plates with extensive experience and a strong technical team, featuring automated and mechanized production.

Have you exported goods before and to which regions?

60% of our total production is exported to Japan, India, UK, Canada, USA, and Brazil.

How many employees do you have?

Approximately 100 employees across sales, purchasing, engineering, QA, warehouse, and production departments.

Can you provide samples if we agree with the design?

Yes, we provide samples for confirmation before mass production, along with technical drawings if required.

What packing methods do you use?

Customized packing with normal cartons and tight-proof fabric or wooden cartons for optimal protection during transportation.

Do you provide technical support for product issues?

All products are fully inspected before shipping. For any issues, we provide immediate technical solutions.

Tags:

Liquid Cooling Plate

Liquid Cold Plate

Cold Plate

Chill Plates

Cooling Plate

Water Cooling Plate

Skived Fin Heat Sink

Optical Fiber Cold Plate

Extruded Heat Sink

Heat Sink Plates

Microchannel Heat Exchanger

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