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Staggered Fin High Temperature Cold Plate Copper Liquid Cooling Radiator Design

Brand Name:	Uchi
Model Number:	T1000
MOQ:	100pcs
Price:	Negotiable
Payment Terms:	T/T，paypal， Western Union,MoneyGram
Supply Ability:	50000000pcs per Month

Detail Information

Product Description

Detail Information

Place of Origin:

Dongguan，Guangdong,China

Certification:

SMC

Temper:

T3~T8

Grade:

1000 Series

Alloy Or Not:

Non-Alloy

Tolerance:

0.05 Mm

Shape:

Square

Process:

Brazed Skived Fin

Certificate:

ISO 9001:2000 ISO 14001:2004

Highlight:

Staggered Fin Cold Plate

High Temperature Copper Radiator

Liquid Cooled Cold Plate

Product Description

Staggered Fin High Temperature Cold Plate Copper Liquid Cooling Radiator Design

High-temperature Copper Staggered Fin Radiator For Liquid Cooling Plate

Heat dissipation plays a pivotal role in the development of the digital economy. As the physical cornerstone of digital infrastructure and an indispensable key link in the computing power industry chain, thermal management technology strongly underpins various digital scenarios—from national-level data centers, artificial intelligence computing clusters and supercomputing centers down to personal computers, smartphones and Internet of Things (IoT) devices—serving as a robust hard-core support for the steady operation and sustained growth of the digital economy.

Applications in High-end Manufacturing

Semiconductor and Chip Manufacturing

Advanced packaging technologies (e.g., 3D stacking) lead to heat accumulation inside chips, where the thermal conductivity of traditional materials has become a bottleneck.

AI Computing/Data Centers

With the surging heat flux density of chips, traditional cooling methods are struggling to meet the demand, making thermal management an "invisible ceiling" that restricts the improvement of computing power.

Aerospace

The space environment features extreme temperatures and high vacuum, where convective heat dissipation is not feasible. As a result, aerospace equipment is exposed to harsh temperature fluctuations.

Applications in Daily Life

Digital Devices: Internal heat dissipation modules composed of metal cooling fins are fitted in computers, mobile phones, game consoles and other devices to ensure their sustained performance.
Communication Devices: To guarantee the stability of high-speed data transmission and processing, these devices are usually equipped with large heat sinks.
Household Appliances: Compressors and external unit condensers require efficient heat dissipation performance, as they continuously transfer heat from indoor spaces to the outdoors.
Lighting Devices: Efficient heat dissipation design ensures the luminous efficacy and long service life of LED lamp beads; the realization of energy conservation is inseparable from the support of heat dissipation technology.
New Energy Vehicles: New energy vehicles require a sophisticated liquid cooling system to maintain an optimal operating temperature.

Key Points in Traditional Heat Dissipation Manufacturing

Traditional air-cooling technology is no longer able to meet the heat flux density demand of over 50W/cm² for high-performance processors such as AI chips.
The performance of thermal conductive materials has hit a bottleneck, and the thermal conductivity coefficient of conventional thermal greases is difficult to exceed 5W/m*K.
Although liquid cooling technology delivers superior performance, it features complex production processes and high technical requirements.

Product Transformation and Upgrading

The heat dissipation industry is undergoing a strategic transformation from a supporting industry to a key core technology sector. Its upgrading path is clearly defined:

Technology: Shifting from uniform heat dissipation to precision temperature control, with liquid cooling technology emerging as the mainstream solution
Industrial Positioning: Transforming from a manufacturer to a "heat dissipation as a service" solution provider
Material Systems: Evolving toward high thermal conductivity and intelligence
Manufacturing Paradigms: Deeply integrating digitalization and additive manufacturing

Essentially, this transformation is an identity revolution from an auxiliary process to a leading design. Heat dissipation capacity has become one of the core indicators for measuring the competitiveness of the digital economy.

Cold Plate Radiator Design

Custom internal flow channel design based on customer power consumption data and heat distribution patterns. Our engineering process includes comprehensive simulation analysis with iterative parameter adjustments to achieve optimal thermal and hydraulic performance targets.

Company Advantages

Powerful Equipment & Hardware Capabilities

The mold workshop is equipped with 22 sets of electric discharge machines (EDM) of various types, including 2 MAKINO mirror EDM machines. It also has 9 wire-cut EDM machines (low-speed), among which 3 are Seibu wire-cut EDM machines and 1 is Sodick wire-cut EDM machine imported from Japan. In addition, the workshop is furnished with 7 spark erosion machines, 10 grinding machines, 2 milling machines and 1 lathe.

Specification	Value
Table size	500×350 mm
Rapid traverse speed	5000 mm/min
Maximum workpiece weight	500 kg
Maximum electrode weight	50 kg

High Machining Precision

Adopting the new SuperSpark4 and IES (Intelligent Expert System) technologies, we provide advanced adaptive power supply and jump control to stabilize the EDM process and improve machining precision simultaneously. Equipped with advanced ultra-surface and ultra-edge generator technologies, the workshop is capable of achieving excellent surface finish and metallurgical quality.

Liquid Cooling System Technology

High-power liquid cooling systems require heat sinks capable of rapid heat absorption. Leveraging the high specific heat capacity of liquids, our systems transfer large amounts of heat through liquid flow, capable of dissipating heat ranging from several hundred watts to over one kilowatt.

Liquid Cold Plate Varieties

Buried-tube Liquid Cold Plate: Fabricated by grooving plates, burying and welding copper tubes inside, then hermetically sealing via welding. Ensures reliable liquid tightness, operational safety, and high flatness for excellent thermal contact.

Inserted-tube Liquid Cold Plate: Manufactured by embedding copper tubes onto aluminum plate surfaces using welding or bonding processes, with strict flatness control for minimal thermal resistance.

Channel-type Liquid Cold Plate: Internal flow channels formed on copper or aluminum substrates through drilling, extrusion, and precision machining, sealed via friction welding or high-temperature brazing.

Liquid Cooling Block: For high-power chip heat dissipation with internal flow channels created through skiving fin technology to maximize heat exchange surface area.

Material-Specific Cooling Products

Copper-brazed Liquid Cooling Products: GB200 liquid cooling module, H20 liquid cooling module, optical module liquid cooling module, and other copper cold plates. Compatible with phosphor copper, silver-based, nickel-based and gold-based solders.

Aluminum-brazed Liquid Cooling Products: LTS siphon radiator, die-cast electronic control liquid cooling box, power supply stamped liquid cooling plate, motor electronic control liquid cooling plate, 6G-3DRVC radiator, and other brazed liquid cooling radiators.

Stainless Steel-brazed Liquid Cooling Products: Liquid cooling manifold, DIMM liquid cooling module, and other stainless steel liquid cooling manifolds.

Quality Assurance

We maintain rigorous quality standards with comprehensive testing equipment including:

1 Coordinate Measuring Machine
1 projector instrument
2 water high pressure testing machines
4 thermal resistance testing machines
2 liquid leakage testing machines

Customer Service Commitment

Prompt response to all inquiries
Competitive pricing with guaranteed quality
Efficient production scheduling
Optimal transportation solutions
Comprehensive technical support

Frequently Asked Questions

Are you a trading company or manufacturer?

We are a professional manufacturer of heat sinks and water cooling plates with extensive experience and a strong technical team, featuring automated and mechanized production.

Have you exported goods before and to which regions?

60% of our total production is exported to Japan, India, UK, Canada, USA, and Brazil.

How many employees do you have?

Approximately 100 employees across sales, purchasing, engineering, QA, warehouse, and production departments.

Can you provide samples if we agree with the design?

Yes, we provide samples for confirmation before mass production, along with technical drawings if required.

What packing methods do you use?

Customized packing with normal cartons and tight-proof fabric or wooden cartons for optimal protection during transportation.

Do you provide technical support for product issues?

All products are fully inspected before shipping. For any issues, we provide immediate technical solutions.

Tags:

Liquid Cooling Plate

Liquid Cold Plate

Cold Plate

Chill Plates

Cooling Plate

Water Cooling Plate

Skived Fin Heat Sink

Optical Fiber Cold Plate

Extruded Heat Sink

Heat Sink Plates

Microchannel Heat Exchanger

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