As thermal densities continue to rise in high-performance computing and precision industrial equipment, traditional cooling solutions often face a trade-off between weight and cost. Replacing copper with aluminum in cooling plates can reduce weight to one-third of the original while delivering significant cost optimization. However, the performance ceiling of aluminum liquid cooling plates largely depends on the precision of flow path design and thermal conduction efficiency at contact surfaces.
Kawaso Texcel, with years of specialization in liquid cooling technology, utilizes premium A1050 and A6063 aluminum alloys for its cooling plates. Through rigorous vacuum brazing and flux brazing processes, the company achieves seamless integration between main bodies, cover plates, and connectors. For applications requiring extreme cavity purity, the vacuum brazing method effectively eliminates gas residues.
The manufacturing process presents unique challenges due to the close melting points of aluminum and brazing materials, demanding precise temperature control within furnaces. This technical requirement forms the core barrier ensuring product reliability.
The cooling plate series offers maximum dimensions of 800mm (length) × 500mm (width), with cooling surface flatness and parallelism strictly maintained within 0.02mm to ensure optimal contact with heat sources. To address aluminum's corrosion resistance during prolonged operation, stainless steel connectors are implemented.
Recommended cooling media include:
This dissimilar metal joining technology maintains structural integrity while significantly extending system lifespan.
Beyond standardized production, Kawaso Texcel offers customized designs tailored to specific thermal loads and spatial constraints. The company supports material combinations including copper, aluminum, and stainless steel. An in-house laboratory facilitates comprehensive performance validation under simulated extreme operating conditions.
Through optimized flow path designs and refined manufacturing processes, aluminum liquid cooling plates have emerged as an ideal solution balancing thermal performance, weight reduction, and cost efficiency for modern cooling applications.