|
| Brand Name: | Uchi |
| Model Number: | Heat Sink |
| MOQ: | 100pcs |
| Price: | 1300-1500 dollars |
| Payment Terms: | T/T，paypal， Western Union,MoneyGram |
| Supply Ability: | 50000000pcs per Month |
Power liquid cooling plate refers to a high-power liquid cooling heat sink specially designed for power electronic equipment. It is mainly used in scenarios such as photovoltaic inverters, wind power converters, SVG, high-voltage inverters, PCS energy storage converters, and high-voltage power transmission and transformation equipment.
It features high pressure resistance, large current carrying capacity, high reliability, long service life and corrosion resistance, belonging to industrial-grade / power-grade water cooling components.
Core heat dissipation targets: IGBTs, SiC power modules, diodes, reactors, power resistors, etc.
Single module power often ranges from dozens of kW to hundreds of kW with high heat flux density, requiring low flow resistance and high heat exchange efficiency.
Power equipment operates continuously for a long time, requiring a water pressure resistance of 3-10 bar. Must pass helium mass spectrometer leak detection with nearly zero leakage.
Commonly used designs:
Ensures temperature uniformity and avoids local hotspots that cause equipment failure.
Mainstream materials: aluminum alloy 5052 / 3003 / 6061
For poor water quality, coastal or chemical environments, surface treatments include:
Prevents scaling, corrosion and water leakage.
Thick base plate and stiffener design to avoid deformation during vibration, transportation and long-term operation of power equipment.
Copper / aluminum tubes embedded in aluminum plates. Low cost, mature and stable. Suitable for low-to-medium power conventional power equipment.
Multi-layer plates and flow channels formed by brazing. Strong heat exchange, good flatness. Suitable for high-power IGBT / SiC modules.
Large size, high reliability. Suitable for high-power wind and photovoltaic equipment.
High strength, flexible flow channel design. Mostly used for customized power cabinet cooling.
| Parameter | Specification |
|---|---|
| Working pressure | 3-6 bar |
| Bursting pressure | ≥ 9 bar |
| Leak detection standard | Helium leak rate ≤ 1×10⁻⁸ Pa*m³/s |
| Temperature resistance | -40℃ ~ 120℃ |
| Surface flatness | ≤ 0.1 mm (for power module mounting) |
| Roughness | Ra ≤ 1.6-3.2 |
| Inlet & outlet ports | G1/4, G3/8, G1/2 threads or quick-connect connectors |
Power liquid cooling plate is the "special heat dissipation base plate" for power electronic equipment. Its core requirements can be summarized in three points: strong heat dissipation, no liquid leakage, and long service life.
Core: Low Thermal Resistance, High Efficiency, No Hotspots
Optimized flow channel design maximizes heat exchange area and minimizes thermal resistance, supporting continuous full-load cooling for high-power IGBT/SiC modules. Excellent temperature uniformity eliminates local hotspots, preventing power derating or component failure. Reasonable flow resistance matches the working conditions of the system water pump, ensuring stable heat dissipation efficiency under high flow rates.
Core: Reliable Sealing, Zero Leakage
High-strength welding processes such as vacuum brazing or friction stir welding are adopted to form an integrated, monolithic structure. Continuous welds with no cold joints or pores deliver high pressure resistance and resist fatigue cracking during long-term operation. 100% helium mass spectrometer leak testing is performed before delivery, strictly controlling the leakage rate to prevent short circuits and burnout of power equipment caused by liquid leakage.
Core: Longevity, High Reliability
Materials resist corrosion and scaling, adapting to industrial, power grid and automotive water quality environments. High structural strength provides vibration and impact resistance, supporting uninterrupted long-term operation. Excellent resistance to high and low temperature cycles and thermal fatigue, with a design life matching the 10-20 year long-term service of power equipment.
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