Copper Skived Process Fins Heat Sink High Power Thermal Solutions Cooling
High-performance copper heat sink with skived fin technology designed for superior thermal management in demanding applications.
Product Specifications
Material: Copper
Size: 54×50×46mm
Weight: 0.464kg
Technology: Skiving fin
Surface Treatment: Passivation
Heat Cooling Power: 168W
Key Features
Higher cooling power and better conductivity
8-15% increased heat dissipation efficiency compared to other heat sinks
Optimized for high-power device cooling under air cooling conditions
Mature manufacturing technology with automated production
Technology Overview
Skiving fin technology involves mechanically cutting material at specific angles to create sequential gap structures from strip profiles (aluminum and copper). This process produces highly efficient heat sinks specifically designed for high-power thermal management applications.
Applications
Ideal for UPS systems, base stations, charging piles, frequency converters, controllers, wind power converters, SVG systems, and LED lighting applications.
Product Images
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