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Extruded Heat Sink
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Deep Buried Copper Pipe Double Loop Fiber Laser Water Cooling Plate for Cold Plate

Deep Buried Copper Pipe Double Loop Fiber Laser Water Cooling Plate for Cold Plate

Brand Name: Uchi
Model Number: Heat Sink
MOQ: 100pcs
Price: 1300-1500 dollars
Payment Terms: T/T,paypal, Western Union,MoneyGram
Supply Ability: 50000000pcs per Month
Detail Information
Place of Origin:
Dongguan,Guangdong,China
Certification:
SMC
Material:
Copper And Aluminum
Product Dimension:
Can Be Customized
Product Weight:
3.4kg
Feature:
New Technology And High Power Cooling
Surface Treatment:
Oil Cleaning And Anti-oxidation
Heat Conducting Power:
450 W
Product Technology:
Welding And Pipes Bending
Type:
Aluminum Profile
Thermal Conductivity:
≥ 180 W/m·K
Texture Of Material:
6061
Tube Dimensions:
K-1/4”, K-3/8”, K-1/2”
Corrosionresistance:
Yes, With Proper Coating
Thickness:
0.30mm--Customized
Mountingoptions:
Screw Holes Or Adhesive Pads
Humidity:
5%~90%
Weight:
Varies Depending On Size And Material
Treatment:
PassivationHeat Conducting
Application:
RGB Laser Light Source
Product Weight:
1.198kg
Body Material:
Aluminum
Power Interface:
3Pin
Highlight:

Fiber Laser Water Cooling Plate

,

Copper Pipe Cold Plate

,

Double Loop Water Cooling Plate

Product Description
Deep Buried Copper Pipe Double Loop Fiber Laser Water Cooling Plate for Cold Plate
Deep buried copper pipe double loop fiber laser water cooling plate - front view Deep buried copper pipe double loop fiber laser water cooling plate - side view Deep buried copper pipe double loop fiber laser water cooling plate - detailed view

Aluminum Skiving Heatsink (with fins)

A high-performance air cooling heatsink manufactured by cutting thin fins directly from a single aluminum block.


Product Overview
  • Manufactured from one solid aluminum block (typically AL1060, AL6063)
  • Fins are precision-cut and bent upward using specialized skiving machinery
  • Base and fins are integral components - no welding, soldering, or adhesive bonding required

Key Advantages
  • Exceptionally low thermal resistance with no contact resistance between base and fins
  • Capable of thin, dense fin configurations (0.2-1.0 mm thickness) with higher density than extrusion heatsinks
  • Ideal for high-power cooling applications including high-power LEDs, inverters, power supplies, EV components, and server systems
  • Fully customizable shapes and sizes without expensive extrusion molds

Cooling Mechanism
  1. Heat transfers from device to heatsink base
  2. Heat spreads uniformly through aluminum material
  3. Heat transfers to multiple thin fins
  4. Fins dissipate heat to air through convection (natural or fan-assisted cooling)

Typical Structure
  • Base: Flat surface optimized for mounting to heat source
  • Fins: Vertical orientation, thin profile, high density, straight configuration
  • Surface Treatment: Black anodized finish for enhanced cooling performance and corrosion resistance

Common Applications
  • High-power LED lighting systems
  • Server, CPU, and GPU cooling solutions
  • Electric vehicle power modules and inverters
  • Industrial power supply units
  • 5G communication equipment