products details

Home Products

Deep Buried Copper Pipe Double Loop Fiber Laser Water Cooling Plate for Cold Plate

Name: Deep Buried Copper Pipe Double Loop Fiber Laser Water Cooling Plate for Cold Plate
Brand: Dongguan Uchi Electronics Co.,Ltd
SKU: Heat Sink
Price: 1,400.00 USD
Availability: InStock

Brand Name:	Uchi
Model Number:	Heat Sink
MOQ:	100pcs
Price:	1300-1500 dollars
Payment Terms:	T/T，paypal， Western Union,MoneyGram
Supply Ability:	50000000pcs per Month

Detail Information

Product Description

Detail Information

Place of Origin:

Dongguan，Guangdong,China

Certification:

SMC

Material:

Copper And Aluminum

Product Dimension:

Can Be Customized

Product Weight:

3.4kg

Feature:

New Technology And High Power Cooling

Surface Treatment:

Oil Cleaning And Anti-oxidation

Heat Conducting Power:

450 W

Product Technology:

Welding And Pipes Bending

Type:

Aluminum Profile

Thermal Conductivity:

≥ 180 W/m·K

Texture Of Material:

6061

Tube Dimensions:

K-1/4”, K-3/8”, K-1/2”

Corrosionresistance:

Yes, With Proper Coating

Thickness:

0.30mm--Customized

Mountingoptions:

Screw Holes Or Adhesive Pads

Humidity:

5%～90%

Weight:

Varies Depending On Size And Material

Treatment:

PassivationHeat Conducting

Application:

RGB Laser Light Source

Product Weight:

1.198kg

Body Material:

Aluminum

Power Interface:

3Pin

Highlight:

Fiber Laser Water Cooling Plate

Copper Pipe Cold Plate

Double Loop Water Cooling Plate

Product Description

Deep Buried Copper Pipe Double Loop Fiber Laser Water Cooling Plate for Cold Plate

Aluminum Skiving Heatsink (with fins)

A high-performance air cooling heatsink manufactured by cutting thin fins directly from a single aluminum block.

Product Overview

Manufactured from one solid aluminum block (typically AL1060, AL6063)
Fins are precision-cut and bent upward using specialized skiving machinery
Base and fins are integral components - no welding, soldering, or adhesive bonding required

Key Advantages

Exceptionally low thermal resistance with no contact resistance between base and fins
Capable of thin, dense fin configurations (0.2-1.0 mm thickness) with higher density than extrusion heatsinks
Ideal for high-power cooling applications including high-power LEDs, inverters, power supplies, EV components, and server systems
Fully customizable shapes and sizes without expensive extrusion molds

Cooling Mechanism

Heat transfers from device to heatsink base
Heat spreads uniformly through aluminum material
Heat transfers to multiple thin fins
Fins dissipate heat to air through convection (natural or fan-assisted cooling)

Typical Structure

Base: Flat surface optimized for mounting to heat source
Fins: Vertical orientation, thin profile, high density, straight configuration
Surface Treatment: Black anodized finish for enhanced cooling performance and corrosion resistance

Common Applications

High-power LED lighting systems
Server, CPU, and GPU cooling solutions
Electric vehicle power modules and inverters
Industrial power supply units
5G communication equipment

Tags:

Liquid Cooling Plate

Liquid Cold Plate

Cold Plate

Chill Plates

Cooling Plate

Water Cooling Plate

Skived Fin Heat Sink

Optical Fiber Cold Plate

Extruded Heat Sink

Heat Sink Plates

Microchannel Heat Exchanger

products details